FE-Simulation of Micro Bending

Pucher, H.J

PLANSEE TIZIT Aktiengesellschaft, Reutte, Austria

Micro metal forming plays a less observed though decisive role in the field of assembling integrated circuits, for example in the manufacturing of semiconductors. Ongoing miniaturization combined with an increasing number of POs has inevitably lead to ever finer lead geometries. The reduction of the pitch and down scaling of lead thickness and lead width has increased the demands put upon the etching process or the blanking process used to manufacture the lead frames, as well as the demands put upon the bending process to form the leads. The development and optimization of bending processes like this is connected with time consuming and costly experiments. Therefore, the FE-simulation of the bending processes of leads could be a helpful tool for the designer and quality assurance of the goods received. Within the scope of this paper the influence of the lead material, the bending tool geometry, as well as the friction conditions during the bending process with respect to the gull-wing lead geometry will be discussed.

Keywords: electronic packaging, simulation, bending process, lead material